鎮東特殊材料有限公司

鎮東特殊材料有限公司

NEW HONG KONG PRODUCTS CO.,LTD.

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Metal raw materials - non-ferrous industrial metal film - Test

Solder mask templates and chemical etching industry needs a special performance of high-quality stainless steel. Material must be flat, without surface defects, is free of residual stresses caused by the cold. In the PCB industry's sustained miniaturization means are placed in solder paste printing quality requirements more stringent. This means that the substrate must meet strict thickness tolerances, showing stable mechanical properties. Our material meets all of these requirements, and to ensure that the smallest PCB assembly and reflow soldering process of transformation work. Our main purpose is stainless steel in the mold industry, but also a good substrate chemical etching applications. High-quality surface finish, to ensure excellent adhesion and resistance without deformation step etched parts.
Related

Metal raw materials - non-fer

The industry's most widely used non-ferrous structural materials in the aerospace, automotive, machin..

Metal raw materials - non-fer

The industry's most widely used non-ferrous structural materials in the aerospace, automotive, machin..

Metal raw materials - non-fer

The industry's most widely used non-ferrous structural materials in the aerospace, automotive, machin..

Use

Also does not contain any oxygen residues copper deoxidizer. It was actually a very small amount of oxygen and contains some impurities. According to standards, the oxygen content of not more than 0.003% of the total impurity content of not more than 0.05%, 99.95% purity copper. According to the oxygen content and impurity content is divided into I and II OFC oxygen-free copper. No. 99.97% purity oxygen-free copper, the oxygen content of not more than 0.003% of the total impurity content of not more than 0.03%; II pure oxygen without oxygen also free of any residues of copper deoxidizer. It was actually a very small amount of oxygen and contains some impurities. According to standards, the oxygen content of not more than 0.003% of the total impurity content of not more than 0.05%, 99.95% purity copper. According to the oxygen content and impurity content is divided into I and II OFC oxygen-free copper.
Specifications

Material (%): Cu99.96 (min)
Thickness: 0.01mm - 1.50mm
Width: 10mm - 150mm
Tensile strength (N / mm ²): 195 - 315
Elongation (%): 15 - 35 (min)
Hardness (Hv): 55 - 120
Conductivity (% IACS): 102

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